Tuesday, September 12, 8:00 am – 12:00 pm, Dallas, TX
D-31b IPC-2221/2222 Task Group. This task group will meet to work on Revision B to the IPC-2221, Generic Standard on Printed Board Design.

Tuesday, September 12, 1:30 pm – 3:00 pm, Dallas, TX
D-21c Controlled Impedance Task Group. This task group will meet to review goals for a revision B to IPC-2141, Design Guide for High-Speed Controlled Impedance Circuit Boards.

Wednesday, September 13, 8:00 am – 10:00 am, Dallas, TX
1-10c Test Coupon and Artwork Generation Task Group. This task group is responsible for updating test coupon designs for use in both IPC-2221 and the IPC-6010 qualification and performance specifications.

Wednesday, September 13, 1:30 pm – 3:00 pm, Dallas, TX
D-11 Flexible Circuits Design Subcommittee. This subcommittee will meet to work on a Revision B draft to the IPC-2223, Sectional Design Standard for Flexible Printed boards

IPC Webcasts

Design for Excellence – Staying Current with Technology
Three webcasts are planned to define the critical issues of designing electronic products that meet the test for DfM, DfA, and DfT. Many of these issues start during the design process, so that is why the CAD tools used by the designer become a helpmate or contributor to the problems associated with board design, due many times to man/machine interaction.

The webcasts are spaced bi-weekly and after the last one has been completed, a full day seminar will be conducted at IPC Headquarters in Bannockburn where attendees will get a chance to explore the subject in more detail, and get a chance to discuss an open forum the many challenges facing engineers and designers of electronic product.

The webcasts are scheduled on the following dates with their focus shown as indicated:

November 2, 2006 – Design Principles and Product Variation
One hour to overview the most critical considerations that every design faces no matter whether it is for commercial, telecommunications, or for automotive under-the-hood products. What may be important for high stress environments is hardly a factor for high density consumer products that have a three year life cycle. The main focus will be on the design strategy and decision making process.

November 16, 2006 – Printed Board Characteristics and Other Mounting Structures
One hour overview to articulate the variations in providing an interconnecting structure that meets the intended goals of the final product. Building printed boards have become more complex in that they must meet the end-product reliability requirements and not degrade during the fabrication or assembly process. The focus will be on the possible mounting failure mechanisms and why they might occur.

November 30, 2006 – Functional Assembly Methodology and Implementation
One hour overview to address the key points in the assembly process and define the relationships between the different assembly and attachment options. What was a critical issue with mixed assembly with through hole and surface mount parts has become catastrophic for assembly that must meet the requirements of using lead free processes. The focus will explore various assembly options and the sequence of events that provide the best compromise of conflicting issues.

IPC Design Workshops

December 7, 2006 – Design for Excellence/ Exploring the Challenges
Eight hours of detailed discussions on all the characteristics that must be considered to make a design manufacturable. This includes the electronic product features, the environment in which it must operate, the material properties, the assembly sequences, and the verification methods used to ensure high quality and reliability. Participants may bring the problems they face on a daily basis and receive some constructive opinion based on existing industry standard capability.