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Gary Ferrari,
Ferrari Technical Services
- Chair, D-31b IPC-2221/2222 Task Group
The IPC D-31b task group is gearing up for a Revision B effort of the IPC-2221 printed board design standard. What are some of the things that designers will need to take into consideration as we progress toward lead free assembly processes?
The committee is considering a broad spectrum of items for the revised IPC-2221 standard, such as a review of laminate material and surface finish selections for lead free compatibility in assembly and repair. Construction issues such as hole aspect ratios will also need to be revisited along with component placement as it relates to higher speed circuits and soldering processes.
IPC is set to release the IPC-4761 guideline document for via protection. Why is it important to follow up with detailed design requirements for via protection concepts in IPC-2221B?
Blind and buried via technology is steadily increasing in use and the industry has developed numerous methodologies for via protection. Some represent very good alternatives while others may seem good on the surface, but pose possible reliability risks. IPC-4761 does not specifically make recommendations, but highlights the good and bad issues surrounding each of the alternatives. IPC-2221 will distinguish which alternatives will work for which classes of products.
What are some of the other areas of change anticipated for
IPC-2221B requiring industry feedback and support?
Many variations in constructions have placed pressure on existing quality conformance coupons. To this end, the committee will review the industry needs and where necessary will develop an appropriate coupon design. In some cases, industry testing and/or data may be sought for inclusion in the standard. We need these construction variations captured so that we may assess the design, fabrication, assembly and test problems associated with them and their impact on our standards.
The area of performance testing has also grown since the last release. We will look at what is currently available and will provide the designer with some application guidance.
The committee also plans to update the standard to reflect greater use of SMT type components such as SMT connectors and BGAs. There is also greater concern for thermal management both within the board and on it, and that section must be included.
I think that when the smoke finally clears, we will not only have defined what needs to be changed in IPC-2221 but also make recommendations for other standards that dovetail with ours.
How do you handle stress?
Stress? There’s no stress in our profession. I learned a long time ago that stress is induced by oneself. We are our own worst enemy. Sure, we have deadlines to meet, family obligations, etc. But in the end we’ve learned that it all works out. I exercise and backpack to release any stress buildup. And most of all, I don’t allow myself to get stressed out by day-to-day issues. There are certainly more important things in life.
What’s the best advice you’ve ever given or received?
I really have to relate this question to the last question on stress. We are all conscientious and want to do a great job. Some of us tend to get stressed out which results in damage to our health and/or the health of those around us. My recommendation has always been that the job will always be there. If you mess up, you can fix it. But there are no do-overs for one’s health. Your health and family must come first. Otherwise, there may be no tomorrow to meet the next project deadline. Don’t get me wrong, I’ll work just as hard as the next guy, but I know when to draw the line.
What’s the most exciting thing about your job?
Working with people. I teach a number of technical and designer certification workshops throughout the year. There is a lot of self satisfaction in passing on knowledge gained over the years and I get just as much satisfaction from receiving information. My legacy, if there is such a thing, is that as I’ve walked (and sometimes ran) along the path of life, I have helped those who have needed it.
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